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Products

HYG812A01025A

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HYG812A01025A
HYG812A01025A
Production process

Specification
Code HYG812A01025A Customer PN


Layer 1 Blind/Buried Via NO

Base Material ALU
Unit Size(mm) 266.0000
X 266.0000
Board thickness 0.8mm Panle Size(mm) /
X /
Min hole 1.1mm Pcs/Panle / X /
Total Holes 10/PCS Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 20/9.8 Min Hole Copper Thickness 20um

Outline Finish CNC
Finish thickness tolerance +/-0.1mm

Contour tolerance +/-0.15mm Surface Finishing
HASL Lead Free


X-out / Solder Mask White

Special request Resistance welding thickness 10um, top layer plus UL mark, cycle
Silkscreen Black

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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